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- Newsgroups: sci.electronics
- Path: sparky!uunet!sun-barr!ames!saimiri.primate.wisc.edu!usenet.coe.montana.edu!news.u.washington.edu!carson.u.washington.edu!whit
- From: whit@carson.u.washington.edu (John Whitmore)
- Subject: Re: Heat sink
- Message-ID: <1992Nov18.224431.4167@u.washington.edu>
- Keywords: Modelling
- Sender: news@u.washington.edu (USENET News System)
- Organization: University of Washington, Seattle
- References: <msolomon-051192173749@mac61177.mitre.org> <1992Nov16.162241.2928@wam.umd.edu> <1e8p9mINNa4o@iskut.ucs.ubc.ca>
- Date: Wed, 18 Nov 1992 22:44:31 GMT
- Lines: 18
-
- In article <1e8p9mINNa4o@iskut.ucs.ubc.ca> ivar@unixg.ubc.ca (ivar jonsson) writes:
- >I am looking for S/W packages that are capable to model and simulate
- >a HEAT SINK . My objective is to optimize the haet removal from a high
- >powered circuit. Any suggestions will be helpfull.
-
- How about SPICE? You just make a subcircuit for
- the heat (heat capacity = capacitor, heat source= current source,
- temperature= voltage on capacitor, heat dissipation = voltage-dependent
- current source) and let SPICE solve it.
-
- This will require extensive information on air flow,
- temperature, and the characteristics of the heat sinks. Usually
- these are specified only as limits, not as accurate values,
- so some experimentation will be required in any case.
-
- John Whitmore
-
-
-