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- Newsgroups: alt.cad
- Path: sparky!uunet!caen!uwm.edu!src.honeywell.com!englehar
- From: englehar@src.honeywell.com (Matt Englehart)
- Subject: professional cad packages
- Message-ID: <1992Nov18.150658.27513@src.honeywell.com>
- Sender: news@src.honeywell.com (News interface)
- Nntp-Posting-Host: akela.src.honeywell.com
- Organization: Honeywell Systems & Research Center
- Date: Wed, 18 Nov 1992 15:06:58 GMT
- Lines: 24
-
- I have been instructed by my boss to quickly provide a summary of the major
- software packages available for mechanical, thermal, and electrical design
- and analysis. The sort of capabilities we're interested include, but are
- not limited to:
-
- 1. Thermal gradiant analysis
- 2. Mechanical interference anaysis (analysis of how/when physical components
- will fit inside a container of fixed size)
- 3. Printed circuit board layout
- 4. Simulation of (analog and digital) circuit functionality and layout
-
- I am interested in any information regarding functionality and cost of
- these sort of packages. Is there any document, journal article, or catalog
- that presents a suite of software packages of this type?
-
- Please email to englehar@src.honeywell.com
-
- Thanks,
-
- Matthew J. Englehart Voice: (612)-951-7635
- Honeywell Systems and Research Center FAX: (612)-951-7438
- 3660 Technology Dr. MS:MN65-2500 Inet: englehar@src.honeywell.com
- Minneapolis, MN 55418
-
-