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Internet Message Format  |  1993-01-28  |  1.1 KB
  1. Path: sparky!uunet!ulowell!news.bbn.com!usc!hacgate!daops6!tony
  2. From: tony@daops6.scg.hac.com (Tony Wong)
  3. Newsgroups: sci.electronics
  4. Subject: Junction to Case Thermal Resistance Database
  5. Keywords: Theta-jc, Thermal Resistance
  6. Message-ID: <24870@hacgate.SCG.HAC.COM>
  7. Date: 26 Jan 93 21:04:56 GMT
  8. Sender: news@hacgate.SCG.HAC.COM
  9. Reply-To: ktwong@igate1.hac.com (Anthony Wong)
  10. Organization: Hughes Aircraft Co., Tucson, AZ
  11. Lines: 20
  12.  
  13.  
  14. Greetings,
  15.  
  16. I am in search of databases with junction to case thermal resistance
  17. values (Theta-jc) for both common and exotic electronic components 
  18. currently in use.  I am interested in values for a variety of packages,
  19. including DIPs, circular can packages (the TO-X series), MPAKs, QPAKs,
  20. LCCs, etc.
  21.  
  22. Please email me at ktwong@igate1.hac.com if you have any or can suggest
  23. where to look for these databases.
  24.  
  25. Thank You
  26. Anthony Wong
  27.  
  28. -- 
  29. ---------------------------------------------------------------------------
  30. Anthony K.T. Wong, Hughes Missile Systems Company, ktwong@igate1.hac.com  |  
  31. ---------------------------------------------------------------------------
  32. (Opinions expressed are mine, not my employers')
  33.