home *** CD-ROM | disk | FTP | other *** search
- Path: sparky!uunet!spool.mu.edu!uwm.edu!linac!att!cbnewsc!cbfsb!att-out!ucbeh.san.uc.edu!yuanj
- From: yuanj@ucbeh.san.uc.edu
- Newsgroups: sci.materials
- Subject: Re: TEM samples
- Message-ID: <1992Dec23.223407.2304@ucbeh.san.uc.edu>
- Date: 23 Dec 92 22:34:07 EST
- References: <38005@uflorida.cis.ufl.edu> <009657AA.10D74A80@vms.csd.mu.edu>
- Distribution: usa,world
- Organization: Univ. of Cincinnati
- Lines: 18
-
- In article <009657AA.10D74A80@vms.csd.mu.edu>, 5916rahmank@vms.csd.mu.edu ( ) writes:
- >
- > Sushil,
- >
- > Dicing saw may not be a good thing to use to cut non-metallic
- > samples. Instead, you may use a diamond wafering blade with water as
- > the cutting fluid. If you are going to make TEM samples, you need
- > lot less thicker sample than 15 mil. It is wiser to cut a little
- > thicker and then polish it to thin.
- Usually, for brittle materials, you need to use what is called
- ion-mill to thin the sample down to your desired thickness, which is less than
- 10 micron I think.
- The ion-mill is a ion bombardment system. Argon atoms are
- ionized and accelerated to the sample, therefore kicking off the materials very
- slowly.
- Hope this helps.
-
- J. Yuan
-