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- Path: sparky!uunet!destroyer!cs.ubc.ca!unixg.ubc.ca!ivar
- From: ivar@unixg.ubc.ca (ivar jonsson)
- Newsgroups: sci.electronics
- Subject: Heat sink
- Date: 16 Nov 1992 18:29:10 GMT
- Organization: UBC Pulp & Paper Centre
- Lines: 8
- Sender: ivar@ppc.ubc.ca
- Message-ID: <1e8p9mINNa4o@iskut.ucs.ubc.ca>
- References: <giri.1@umail.umd.edu> <msolomon-051192173749@mac61177.mitre.org> <1992Nov16.162241.2928@wam.umd.edu>
- NNTP-Posting-Host: poplar.ppc.ubc.ca
- Summary: Request for Modelling S/W
- Keywords: Modelling
-
- I am looking for S/W packages that are capable to model and simulate
- a HEAT SINK . My objective is to optimize the haet removal from a high
- powered circuit. Any suggestions will be helpfull.
-
- Best regards,
-
- Ivar Jonsson
- K
-