I-DEAS Electronic System Cooling software is designed to simulate 3-D air flow and thermal behaviour in electronic systems. It is an integrated part of I-DEAS Master Series
software, which means modeling is performed directly with design geometry using the I-DEAS simple and intuitive graphical interface. With I-DEAS Electronic System Cooling, you can model individual components, multichip modules, heat sinks, PC boards as well as complete electronic systems. Unstructured free meshing and powerful mesh coupling technology allow you to simulate both system level and component detail in a single model. The sotware helps you to quickly perform a detailed thermal analysis and pinpoint design problems. It assists with practical engineering challenges including:
Optimizing the placement of critical components
Investigating both forced and natural convection cooling schemes
Positioning and sizing of fans and vents
Spacing requirements between boards and assemblies
Optimizing the size and shape of heat sinks to maximize convection
Effective conductive heat transfer using thermal vias and heat spreaders.
I-DEAS Electronic System Cooling places thermal simulation of electronic products on the critical path of design.
Kevin Duffy
Vice President
Maya Heat Transfer Technologies, Ltd.
4999 St. Catherine West
Suite 400
Montreal, PQ H3Z 1T3
Canada
514-369-5855
514-369-4200 (fax)
kevin@mayahtt.ca
For applications in related solution areas, see the following indices: Design Optimization, Engineering, Simulation, Thermomechanical Analysis, the developer index for Maya Heat Transfer Technologies, Ltd. and the market segment index for Computational Fluid Dynamics (CFD).
I-DEAS Electronic System Cooling is a Trademark of Maya Heat Transfer Technologies,Ltd