Icepak is a complete computer modeling and simulation program that addresses thermal management of electronics. Because Icepak performs coupled thermal/fluid flow simulations, it fully considers design physics by incorporating flow effects as an inherent part of the model.
The software package uses Computational Fluid Dynamics (CFD) to analyze air flow and thermal distribution in enclosed spaces, particularly those containing electronic components. The program helps the design engineer create new designs, test and refine untested designs, and update, revise or improve old designs.
Icepak is easy to use and incorporates a broad range of design functions. The package logically moves users through the natural design path followed by engineers, yet allows for individual choice in how they implement the design process. Navigation is guided by a fully interactive Graphical User Interface (GUI).
Michael Engelman
President
Fluid Dynamics International, Inc.
500 Davis Street
Suite 600
Evanston, IL 60201
USA
708-491-0200
708-869-6495 (fax)
engelman@fdi.com
For applications in related solution areas, see the following indices: Design Optimization, Finite Element Modeling (FEM), Heat/Fluid/Electro-magnetic Flow, Mechanical Engineering, Package Design, the developer index for Fluid Dynamics International, Inc. and the market segment index for Computational Fluid Dynamics (CFD).
ICEPAK is a Trademark of Fluid Dynamics International, Inc.